Prevent costly knowledge loss in manufacturing with six practical strategies for capturing institutional know-how before retirement and turnover hit operations.
SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements directly into the HBM interface layer, reducing thermal resistance by 30% and helping future AI accelerators avoid performance-k…
Imec unveiled the world’s first silicon quantum dot qubit device fabricated with High-NA EUV lithography, suggesting quantum computing may eventually scale using the semiconductor industry’s existing advanced manufacturing…
Huawei Technologies unveiled a new “LogicFolding” chip design framework built on its proprietary Tau scaling law, claiming it can dramatically boost transistor density and power efficiency without EUV lithography — potenti…
It’s understood that meetings are being canceled across Samsung’s non-memory and shared business units.
ASIC-based AI server shipments are projected to reach 27.8% of the market in 2026, the highest share since 2023, and custom ASIC shipments will grow 44.6% year-over-year.
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AMD has announced that its 6th Gen EPYC processor, codenamed Venice, has entered production ramp on TSMC’s N2 process in Taiwan.
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Vertical integration or partnership: that is the question in humanoid robots. The UK’s Humanoid has chosen … and it just announced a big new partner.
Intel says its 14A process technology is on track for high-volume manufacturing in 2029, 10A and 7A to follow in the 2030s.
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What does the world’s largest humanoid robot company think about the future ot work, the future of robots … and how we should think about Chinese robotics companies?