TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes

TSMC says it does not have enough capacity to handle all the demand from AI hyperscalers, with CEO C.C. Wei saying that it will take a long time before it can match customer demand. This is an opportunity for Intel, thoug…

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Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up

Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
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Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led to all 3,600 staff being evacuated

Thousands of SK hynix employees fled their factory stations earlier today as a fire broke out in a room where fluorine gas was used.
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US export controls are pushing China’s AI chip industry away from GPUs and toward custom silicon
 US export controls are pushing China’s AI chip industry away from GPUs and toward custom silicon

China’s AI chip industry is no longer trying to build an Nvidia clone. Under sustained US export controls that block access to the most powerful general-purpose GPUs, the country’s largest technology companies are pivoting toward application-specific i…

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TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China’s dependence on US chipmakers

TikTok owner Bytedance reportedly developing its own custom CPUs in a bid to reduce costs and dependence from US chipmakers
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Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing strategies and IP

We explore Globalfoundries, UMC, and SMIC’s individual trailing-edge roadmaps, as each company is pursuing a fundamentally different strategy shaped by geography, regulation, and technology choices.
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Chinese university builds 3D chip design tool tailored to Huawei’s ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management

The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
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China adds homegrown AI chips to ‘secure and reliable’ procurement list for the first time — nine options added as move away from Nvidia continues

The certifications are valid for three years and were issued jointly by the China Information Technology Security Evaluation Centre and the National Secrecy Science and Technology Evaluation Centre.
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SK hynix unveils ‘iHBM’ thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements directly into the HBM interface layer, reducing thermal resistance by 30% and helping future AI accelerators avoid performance-k…

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Imec builds world’s first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines

Imec unveiled the world’s first silicon quantum dot qubit device fabricated with High-NA EUV lithography, suggesting quantum computing may eventually scale using the semiconductor industry’s existing advanced manufacturing…

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