AMD and Samsung ink memory supply memorandum for EPYC and Instinct products — unprecedented deal also includes scope for foundry partnership

Samsung to remain primary HBM memory supplier for AMD’s AI accelerators as the companies look into possible foundry relationship.

Meta’s new MTIA lineup joins hyperscalers’ unified push for dedicated inferencing chips — companies diversify AI chips in effort to diversify from sole reliance on Nvidia

As Meta introduces its lineup of new AI chips, the company joins other tech giants in diversifying the AI accelerators used for specific workloads, and says that mainstream GPUs built for large-scale pre-training are less …

Intel’s roadmaps examined — 14A, Nova Lake, Diamond Rapids & AI accelerator push

Intel’s CPU roadmap is unlike any the company has published in recent years, because its manufacturing ambitions and its product launches have to succeed simultaneously.

STMicro to deploy humanoid robots to its legacy fabs in Europe — over 100 humanoid robots to be used for routine and physically demanding tasks in fight for efficiency

As cheap Chinese chips threaten to invade various sectors of the economy in Europe, STMicroelectronics is on track to improve the efficiency of its own fabs

Humanoid robots get to work at German BMW factory [video]
Humanoid robots get to work at German BMW factory [video]

After successfully piloting humanoid robots at its Spartanburg, SC plant last year, BMW is putting AI-powered machines to work building EVs at its Leipzig iFACTORY.

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IBM and Lam’s new partnership paves the way toward sub-1nm logic using High-NA EUV — Albany lab to pioneer dry resist process integration

Under the new agreement, the focus will shift to validating full process flows for nanosheet and nanostack device architectures and backside power delivery.

Meta reveals four new MTIA chips built for AI inference — to be released on a six-month cadence

All four chips have been developed in partnership with Broadcom and are scheduled for deployment within the next two years.

IBM and Lam Research team up on High NA EUV dry resist to push chip scaling past 1nm

The two companies have worked together for more than a decade, with IBM unveiling what it described as the world’s first 2nm node chip in 2021 as part of the partnership.