Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers — new standard set to offer reduced power consumption and double the bandwidth versus DDR5 RDIMMs

Samsung has announced its own SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms, pitching it as as a way to bring the power efficiency and bandwidth advantages of LPDDR5X into servers. …

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Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S. — limit exports to two generations behind leading-edge nodes, could slow down U.S. expansion

Taiwan’s government is considering imposing N+2 export rule on TSMC’s advanced process technologies, which would make it significantly harder for the foundry to develop overseas.
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Huawei’s AI chip capabilities still pale in comparison to American silicon — report from U.S. council details that despite fears, Nvidia continues to lead by a wide margin

A new report from the Council on Foreign Relations concludes that Huawei’s AI chip capabilities lag behind Nvidia’s by a wide margin, and that the gap is growing exponentially.
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TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3mn months ahead of schedule — Arizona fab slated for production in 2027

Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.
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Honda to temporarily shut down factories in China and Japan because of chip shortage — disruption caused by fallout from on-going conflict within Nexperia

Honda announced the suspension of operations in five automotive manufacturing plants, citing the lack of legacy chips from Nexperia as the reason behind the move.
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China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028

China has reportedly built and begun testing a secret EUV lithography prototype using ASML-style laser-produced plasma technology. Yet, despite generating 13.5-nm light, the system remains unable to make chips and appears …

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New Texas Instruments fab will pump out tens of millions of chips per day — first 300mm fab starts production after $60 billion investment

Texas Instruments has started producing 300mm wafers at its new Sherman, Texas mega-site, with the SM1 fab capable of outputting tens of millions of chips per day.
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Sales of chip production equipment to reach $156 billion by 2027 — China, Taiwan, and Korea lead intense demand

Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.
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Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for…

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Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

Intel and imec demonstrate the first 300-mm, fab-compatible integration of contacts and gate stacks for 2D transistors, marking a critical step in turning long-studied 2D materials from lab experiments into a realistic fut…

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