Memory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers — forecasts suggest that 2026 revenue will skyrocket thanks to data center demand

While all makers of microelectronics are set to benefit from the AI supercycle, the memory industry is projected to generate more than twice the revenue of the foundry industry.
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TSMC’s board approves $45 billion spending package on new fabs — record sign off signals aggressive expansion to grow capacity

TSMC’s board of directors approves spending on new production capacities and promotes a key executive leading the development of A10 fabrication process due in 2030 or later.
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Taiwan rejects possibility of transferring 40% of the island’s semiconductor capacity to U.S. — production on Taiwan expected to increase in lockstep with increases in U.S.-based production

Taiwan authorities have no problems with TSMC investing in the U.S. as long the bulk of its fabs and leading-edge process technologies remain in Taiwan.
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Semiconductor industry on track to hit $1 trillion in sales in 2026, SIA predicts — bumper forecast follows $791.7 billion haul for 2025

After recording a $791.7 billion revenue in 2025, the semiconductor industry is on track to hit $1 trillion in sales in 2026.
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TSMC is on track to have more employees than Intel for the first time in history — TSMC’s explosive growth stands in contrast to Intel’s rapid contraction

After years of job cuts, Intel is about to get behind TSMC in terms of the headcount.

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Jim Keller’s Tenstorrent is downgrading Blackhole p150 cards from 140 to 120 tensor cores via firmware update — will ship cards with 120 tensor cores going forward, company claims existing users should expect 1-2% performance drop

Tenstorrent downgrades existing and new Blackhole p150 cards from 140 to 120 tensor cores

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Apple concedes it is constrained by TSMC’s supply of advanced chips; storage and memory are also in short supply — firm isn’t projecting supply conditions beyond the second quarter

As Nvidia is ramping up production of the Rubin platform, other 3nm-class process suffer

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China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies

Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts.
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Intel shows off leading-edge tech with massive AI processor test vehicle — huge chip features four logic tiles, 12 HBM4 stacks, and 8X reticle size

Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.
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Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place — concerns mount surrounding U.S deals cracking the nation’s silicon shield

The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC.
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