China has quietly mandated that at least 50% of equipment used for new semiconductor capacity be domestically sourced. However, as China’s industry cannot produce enough lithography tools, authorities tend to get flexible …
TSMC has quietly begun volume production of its 2nm-class N2 process in Q4 2025 as planned, marking the company’s first GAA nanosheet node that will be ramping production at two new fabs to meet strong demand from various …
EUV lithography era in chipmaking began in 2019 and there are no signs that this is going to stop as process technologies are getting more complex. However, there are fundamental reasons why TSMC’s quotes are rising quicke…
Nvidia has announced a $20 billion deal to acquire Groq’s intellectual property, though not the company itself, and absorb key members of its engineering team.
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Yesterday, the ground shook off the coast of Taiwan, slamming the country with the strongest earthquake in 27 years. The seismic wave registered 7.0 in Taiwan’s scales, or 6.6 to 6.7 according to the USGS standard. Thankfu…
Nexperia’s China unit is moving to line up new wafer suppliers over the next six to nine months amid a deepening legal and operational dispute with its Dutch parent company.
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Intel Foundry has released a video of a multi-chiplet 2.5D/3D processor with a 10,296 mm^2 silicon footprint, including leading-edge technologies such as 14A and 18A.
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The adjustment comes as China’s largest foundry runs near full utilization and faces sustained demand from domestic customers building inventories of memory and logic chips.
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TSMC has shared a super-cool digital greetings card with a retro-nostalgic 8-bit style gaming animation.
A reported attempt by a covert Chinese lab to reverse-engineer an EUV lithography scanner underscores that, despite access to scattered components, replicating ASML’s EUV tools is effectively impossible without recreating …