Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces ‘Tau Scaling Law’ to replace Moore’s Law

Huawei Technologies unveiled a new “LogicFolding” chip design framework built on its proprietary Tau scaling law, claiming it can dramatically boost transistor density and power efficiency without EUV lithography — potenti…

The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond

ASIC-based AI server shipments are projected to reach 27.8% of the market in 2026, the highest share since 2023, and custom ASIC shipments will grow 44.6% year-over-year.

AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap

AMD has announced that its 6th Gen EPYC processor, codenamed Venice, has entered production ramp on TSMC’s N2 process in Taiwan.

SEM-Guided Low-kV FIB Finishing for Leading-Edge Semiconductor Failure Analysis
SEM-Guided Low-kV FIB Finishing for Leading-Edge Semiconductor Failure Analysis

Discover how the ZEISS Crossbeam 750 FIBSEM sets a new benchmark for precise TEM lamella prep, tomography, and advanced nanofabrication. This delivers better resolution, better SNR, larger usable FOV, and shorter acquisition times. Learn how uninterru…

Intel kicks off development on next-decade 10A and 7A process technologies — 14A node remains on track for critical October PDK release

Intel says its 14A process technology is on track for high-volume manufacturing in 2029, 10A and 7A to follow in the 2030s.

SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines — equipment makers post record revenue but falling margins

China’s semiconductor equipment vendors collectively posted record revenues in 2025, but profitability is under pressure from domestic price competition.

Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs — 12 designs, priced around $170 each, sold alongside $2 vials of cleanroom air

Russia’s Mikron is earning a bit of cash on the side by selling picture-framed test wafers as souvenirs with 12 designs to choose from, priced around $170.

Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond

All three leading foundries have now entered the 2nm era, but their paths from now on diverge sharply: TSMC bets on predictability, Intel wagers on aggressive architectural shifts, and Samsung’s primary focus is on improvi…