Honda announced the suspension of operations in five automotive manufacturing plants, citing the lack of legacy chips from Nexperia as the reason behind the move.
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China has reportedly built and begun testing a secret EUV lithography prototype using ASML-style laser-produced plasma technology. Yet, despite generating 13.5-nm light, the system remains unable to make chips and appears …
Texas Instruments has started producing 300mm wafers at its new Sherman, Texas mega-site, with the SM1 fab capable of outputting tens of millions of chips per day.
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Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.
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Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for…
Intel and imec demonstrate the first 300-mm, fab-compatible integration of contacts and gate stacks for 2D transistors, marking a critical step in turning long-studied 2D materials from lab experiments into a realistic fut…
Intel has installed and qualified ASML’s TWINSCAN EXE:5200B, the first High-NA EUV lithography tool designed for commercial production, reiterating Intel’s plans to use High-NA EUV patterning for 14A process technology and…
Japan’s Dai Nippon Printing (DNP) claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans for mass production in 2027.
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Qualcomm has agreed to acquire Ventana Micro Systems, a RISC-V CPU specialist whose engineers have spent several years pushing the open instruction set toward high-performance server and edge designs.
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