Google announced its eighth-gen TPUs at Cloud Next, shipping two distinct chip designs for the first time in the TPU program’s decade-long history.
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TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors.
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Bolt Graphics has announced its completed tape-out of a test chip for its Zeus GPU, marking the startup’s first move from FPGA emulation to manufactured silicon.
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Elon Musk reveals details about TeraFab: Intel provides technology, Tesla builds pilot line, SpaceX constructs high-volume fab.
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TSMC strengthens its bifurcated process technology development approach with A14, A13, and N2U aimed at client applications and A16, A12, and N2X for high-performance data center designs.
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A bipartisan group of U.S. lawmakers introduced the Multilateral Alignment of Technology Controls on Hardware Act, or MATCH Act, in early April.
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U.S. lawmakers remove countrywide exports ban on cryogenic etching tools from the MATCH Act, yet Chinese companies could barely get them anyway.
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Intel lures Shawn ‘Seung Hoon’ Han from Samsung Foundry to land new customers and maintain customer relationships at Intel Foundry.
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Elon Musk’s people have begun reaching out to various semiconductor fab suppliers to ask for pricing and delivery timelines as the Terafab project ramps up.
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TSMC unveils aggressive plans to ramp up 3nm-capable capacity further in the coming years amid strong demand from the AI sector.
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