As Nvidia is ramping up production of the Rubin platform, other 3nm-class process suffer
Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts.
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Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.
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The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC.
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Nvidia’s Huang claims that Taiwan will not lose its silicon shield as TSMC expands overseas because demand for leading-edge semiconductor production is so high that a global chipmaking footprint is essential to meet it.
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ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.
Samsung’s Fab in Taylor, Texas, set to start trial production sometimes in the second half of 2026 with mass production slated for 2027. With pellicles finally implemented for 2nm-class flows, Samsung could finally offer c…
Neurophos built a silicon photonics chip that’s 10,000 smaller than current tech and could potentially deliver 10x the performance of Nivida’s Vera Rubin GPUs using the same amount of power and available chip fab technolog…
Intel claims that customers show interest in the 14A process technology; however, they have yet to make a commitment to use it.
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Toilet manufacturer Toto has seen its shares soar at their most rapid pace in five years, as it benefits from AI memory market tailwinds.
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