Honda announced the suspension of operations in five automotive manufacturing plants, citing the lack of legacy chips from Nexperia as the reason behind the move.
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China has reportedly built and begun testing a secret EUV lithography prototype using ASML-style laser-produced plasma technology. Yet, despite generating 13.5-nm light, the system remains unable to make chips and appears …
Texas Instruments has started producing 300mm wafers at its new Sherman, Texas mega-site, with the SM1 fab capable of outputting tens of millions of chips per day.
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Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.
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Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for…
Intel and imec demonstrate the first 300-mm, fab-compatible integration of contacts and gate stacks for 2D transistors, marking a critical step in turning long-studied 2D materials from lab experiments into a realistic fut…
Intel has installed and qualified ASML’s TWINSCAN EXE:5200B, the first High-NA EUV lithography tool designed for commercial production, reiterating Intel’s plans to use High-NA EUV patterning for 14A process technology and…
U.S. Senator Bernie Sanders wants to delay AI data center projects to slow down progress, to ensure that AI will benefit the largest number of people and not just the richest few.
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Nearly 7,000 of the world’s operational data centers are located in climates that fall outside the temperature range recommended for efficient operation, according to a new analysis.
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Orbital data centers have been proposed as a way around the power, cooling, and regulatory requirements of building on Earth, but new analysis reveals that the costs of deploying such installations would be astronomical.
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