China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies

Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts.

Intel shows off leading-edge tech with massive AI processor test vehicle — huge chip features four logic tiles, 12 HBM4 stacks, and 8X reticle size

Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.

AMD CES 2026 gaming trends press Q&A roundtable transcript — ‘we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms’

We sat down with AMD at CES 2026 for a roundtable Q&A all about consumer products for gaming. We cover the full transcript of the press-only session right here.

Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place — concerns mount surrounding U.S deals cracking the nation’s silicon shield

The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC.

Nvidia CEO denies that US wants to shift 40% of Taiwan’s chipmaking capacity to America — Jensen Huang says onshoring is all new capacity, will preserve island nation’s silicon shield

Nvidia’s Huang claims that Taiwan will not lose its silicon shield as TSMC expands overseas because demand for leading-edge semiconductor production is so high that a global chipmaking footprint is essential to meet it.

WinRAR exploit reportedly remains widely-used by China and Russia state actors despite patch — vulnerability allows malicious archives to deliver a hidden payload to Windows Startup folder

Google says that a WinRAR exploit that has been patched six months ago remain a popular attack vector, especially for state-sponsored threat actors. The vulnerability allows malicious archives to install malware on critica…