U.S. slashes Taiwan tariffs in new semiconductor trade deal — Washington to reduce tariffs to 15% in exchange for $500 billion stateside manufacturing investment

The U.S. and Taiwan trade deal will reduce tariffs to 15% from 20%. It will also pour $250 billion in direct investments in U.S. chip manufacturing, as well as another $250 billion in credit guarantees to Taiwanese tech co…

Glass cloth could be the next great AI shortage, as major manufacturers scramble to secure critical material — Japanese manufacturer courted by Apple, Nvidia, Google, and Amazon

One Japanese manufacturer has found itself at the center of a new AI-driven supply shortage. Glass cloth is a crucial component for many components, and with dwindling supplies, companies are looking for alternatives.

Analyzing Washington’s new AI accelerator export rules — smaller manufacturers suffer while Nvidia and AMD will reap the rewards

U.S. introduces new export rules for AI and HPC accelerators developed in America that allow shipments of AMD’s MI325X and Nvidia’s H200 GPUs to Chinese entities, but only if their developers meet demand of American custom…

Amazon buys first American-mined copper in a decade — Arizona mine to fuel AWS AI data centers in seismic two-year deal

Amazon has struck a two-year deal to receive copper from an Arizona mine, for use in its AWS data centers in the U.S.

Shareholders sue Oracle over misleading statements related to $300 billion OpenAI data center build-out — disgruntled plaintiffs say the company lied about how much money it needed to borrow

A group of investors have filed a class action lawsuit against Oracle, contending that it made misleading statements during its initial $18 billion bond drive, resulting in potential losses of $1.3 billion.

U.S. posts official H200 and MI325X AI GPU export rules to China, but with plenty of caveats — a string of requirments greatly limits the total number of GPUs that can be shipped to China

The U.S. may allow shipments of rather powerful AI processors to China on a case-by-case basis, but with the U.S. supply priority, do not expect AMD or Nvidia ship a ton of AI GPUs to the People’s Republic.

AI chip design is pushing advanced chip packaging to its limits – workarounds exist for limits of 2.5D packaging, but are years away from viability

As AI accelerators and HPC devices grow larger and more complex, advanced chip design continues to move away from the transistor and toward the package.