Sales of chip production equipment to reach $156 billion by 2027 — China, Taiwan, and Korea lead intense demand

Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.

Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for…

Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

Intel and imec demonstrate the first 300-mm, fab-compatible integration of contacts and gate stacks for 2D transistors, marking a critical step in turning long-studied 2D materials from lab experiments into a realistic fut…

Intel installs industry’s first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A

Intel has installed and qualified ASML’s TWINSCAN EXE:5200B, the first High-NA EUV lithography tool designed for commercial production, reiterating Intel’s plans to use High-NA EUV patterning for 14A process technology and…

New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes — questions linger as no foundry has yet committed to nanoimprint lithography for high-volume manufacturing

Japan’s Dai Nippon Printing (DNP) claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans for mass production in 2027.

Qualcomm’s Ventana acquisition points to a long-term RISC-V strategy to complement its Arm lineup

Qualcomm has agreed to acquire Ventana Micro Systems, a RISC-V CPU specialist whose engineers have spent several years pushing the open instruction set toward high-performance server and edge designs.