Trump administration announces new tariffs on Chinese chips and electronic components — but fresh sanctions won’t take effect until 2027, and rates remain unknown

The United States has slapped a fresh set of tariffs on Chinese electronic components, but their implementation has been delayed until 2027.
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Nvidia prepares shipment of 82,000 AI GPUs to China as chip war lines blur — H200 shipments with 25% tax to begin as US loosens restrictions

Nvidia is preparing to deliver up to 80,000 H200 AI chips to China before the Lunar New Year holiday, marking the first time this level of silicon would be legally exported to the country since 2022.
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Ten former Samsung employees arrested for industrial espionage charges for giving China chipmaker 10nm tech — executives and researchers allegedly leaked DRAM technology to China-based CXMT, resulting in trillions of losses in Korean Won

10 former Samsung employees are accused of leaking Samsung’s 10-nm DRAM technology to CXMT, allegedly allowing the latter to achieve technological breakthroughs on stolen information.
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Intel’s Fab 52 is bigger and better equipped than TSMC’s Arizona facilities — Intel’s production volume dwarfs TSMC’s operations in the U.S.

Intel’s Fab 52 in Arizona is currently the most advanced chip production facility in America, but it has yet to reach its full 40,000-wafer capacity due to low 18A yields.
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Chinese fabs are reportedly upgrading older ASML DUV lithography chipmaking machines — secondary channels and independent engineers used to soup up Twinscan NXT series

Chinese fabs are quietly extending the useful life and performance of older ASML deep ultraviolet lithography systems by upgrading key subsystems, as Beijing pushes to sustain advanced chip output.
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Surprising biomedical application found for ASML’s chipmaking EUV lithography machines — they can mass produce nanopores for molecular sensing

IMEC has successfully demonstrated the full wafer-scale fabrication of nanopores using ASML’s state-of-the-art extreme ultraviolet (EUV) machines.
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Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers — new standard set to offer reduced power consumption and double the bandwidth versus DDR5 RDIMMs

Samsung has announced its own SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms, pitching it as as a way to bring the power efficiency and bandwidth advantages of LPDDR5X into servers. …

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Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S. — limit exports to two generations behind leading-edge nodes, could slow down U.S. expansion

Taiwan’s government is considering imposing N+2 export rule on TSMC’s advanced process technologies, which would make it significantly harder for the foundry to develop overseas.
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Huawei’s AI chip capabilities still pale in comparison to American silicon — report from U.S. council details that despite fears, Nvidia continues to lead by a wide margin

A new report from the Council on Foreign Relations concludes that Huawei’s AI chip capabilities lag behind Nvidia’s by a wide margin, and that the gap is growing exponentially.
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TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3mn months ahead of schedule — Arizona fab slated for production in 2027

Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.
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