Blockchain analytics company Chainalysis says DPRK has set a record for 2025, with the regime expected to execute more sophisticated attacks in the future.
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A new report from the Council on Foreign Relations concludes that Huawei’s AI chip capabilities lag behind Nvidia’s by a wide margin, and that the gap is growing exponentially.
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Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.
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A study finds that AI has surpassed Bitcoin and the bottled water industry in its use of resources, with other experts saying that the estimate is actually conservative.
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A North Korean imposter was uncovered, working as a sysadmin at Amazon U.S., after their keystroke input lag raised suspicions with security specialists at the online retail giant.
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Honda announced the suspension of operations in five automotive manufacturing plants, citing the lack of legacy chips from Nexperia as the reason behind the move.
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China has reportedly built and begun testing a secret EUV lithography prototype using ASML-style laser-produced plasma technology. Yet, despite generating 13.5-nm light, the system remains unable to make chips and appears …
Texas Instruments has started producing 300mm wafers at its new Sherman, Texas mega-site, with the SM1 fab capable of outputting tens of millions of chips per day.
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Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.
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Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for…