Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

Intel and imec demonstrate the first 300-mm, fab-compatible integration of contacts and gate stacks for 2D transistors, marking a critical step in turning long-studied 2D materials from lab experiments into a realistic fut…

Intel installs industry’s first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A

Intel has installed and qualified ASML’s TWINSCAN EXE:5200B, the first High-NA EUV lithography tool designed for commercial production, reiterating Intel’s plans to use High-NA EUV patterning for 14A process technology and…

Bernie Sanders calls for halt on AI data center construction — wants to ensure that the technology benefits ‘all of us, not just the 1%’

U.S. Senator Bernie Sanders wants to delay AI data center projects to slow down progress, to ensure that AI will benefit the largest number of people and not just the richest few.

Nearly 7,000 of the world’s 8,808 data centers are built in the wrong climate, analysis find — vast majority located outside optimal temperature range for cooling, 600 in locations considered too hot

Nearly 7,000 of the world’s operational data centers are located in climates that fall outside the temperature range recommended for efficient operation, according to a new analysis.

New calculator helps evaluate the economics of datacenters in space — running the numbers on orbital computing reveals a brutal reality

Orbital data centers have been proposed as a way around the power, cooling, and regulatory requirements of building on Earth, but new analysis reveals that the costs of deploying such installations would be astronomical.

New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes — questions linger as no foundry has yet committed to nanoimprint lithography for high-volume manufacturing

Japan’s Dai Nippon Printing (DNP) claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans for mass production in 2027.

Qualcomm’s Ventana acquisition points to a long-term RISC-V strategy to complement its Arm lineup

Qualcomm has agreed to acquire Ventana Micro Systems, a RISC-V CPU specialist whose engineers have spent several years pushing the open instruction set toward high-performance server and edge designs.